Vacuum / High Vacuum Compatible CVD Tube Furnace— Product Description & Specifications
Advanced Process Technology Pvt. Ltd. (APT) presents its high-performance Vacuum / High-Vacuum Compatible CVD Tube Furnace, engineered for chemical vapor deposition (CVD) processes requiring precise temperature control, reproducible results, and robust vacuum integrity.
This system is designed for advanced materials processing—such as thin-film deposition, semiconductor coatings, graphene growth, nanomaterial’s synthesis, nitriding, oxidation, and compound semiconductor growth—where the reaction takes place inside a quartz process tube under controlled vacuum and gas environment.
The furnace integrates advanced thermal hardware, high-vacuum sealing, gas delivery, and control systems to ensure reliable and repeatable operation from low vacuum to high vacuum (<10⁻⁶ mbar).
Key Features
✅ Vacuum & High Vacuum Compatible
- Designed for vacuum levels down to 10⁻⁶ mbar with proper pumping accessories.
- Compatible with turbo molecular pump, dry pumps, and backing pumps.
- UHV compatible seals using CF/KF flanges and proper vacuum greases or metal seals where applicable.
✅ Quartz Process Tube System
- High-purity quartz tube for contamination-free processing.
- Customizable diameter and length based on substrate size.
- Easy installation and replacement.
- Tube design minimizes gas dead volume and ensures uniform thermal distribution.
✅ Uniform Temperature Control
- Advanced heating elements (high-temperature SiC/graphite/metal wire depending on process).
- Precise temperature uniformity across the heated zone (±1–2 °C).
- Typical temperature range: RT to 1400 °C (depending on model).
- Multi-zone temperature profiling (opt for 3–5 zones) for superior gradient control.
✅Advanced Process Gas Handling
- Multiple mass flow controllers (MFCs) with high accuracy (±2% of set point).
- Support for inert, reactive, and reducing gases:
Ar, N₂, O₂, H₂, NH₃, CH₄, SiH₄, B₂H₆, PH₃, etc. - Stainless-steel gas lines with automatic leak checks.
✅ Intelligent Control & Automation
- PLC + touchscreen HMI for process recipe programming.
- Real-time display of temperature, vacuum level, and gas flow.
- Data logging and USB/Ethernet connectivity.
- Safety interlocks for over-temperature, over-pressure, and vacuum loss.
✅ Safety & Reliability
- Over-temperature protection with auto shut-off.
- Emergency power off (EPO).
- Proper gas purging and exhaust pathways.
- Isolation valves for safe maintenance.
Typical Applications
| Application | Industry |
| Thin film deposition (SiO₂, Si₃N₄, etc.) | Electronics |
| Semiconductor material synthesis | Semiconductor |
| Carbon nanotube / Graphene growth | Nanotechnology |
| Oxidation, Nitridation | Material Science |
| Compound semiconductor growth (e.g., GaN) | Optoelectronics |
Technical Specifications
✅ Thermal System
- Max Temperature: Up to 1400 °C (Model dependent)
- Temperature Zones: 3 / 5 zone options
- Control Accuracy: ±1–2 °C
- Heating Uniformity: ±3 °C over hot zone
- Ramp Rate: Up to 15-20 °C/min (depending on load & insulation)
✅ Vacuum System Compatibility
- Ultimate Vacuum: <10⁻⁶ mbar (with turbo molecular + dry backing pump)
- Leak Rate: <10⁻⁹ mbar·L/s
- Seals: CF flanges for UHV / KF flanges for HV
- Measurement: Pirani + cold cathode gauge
✅ Process Tube
- Material: High-purity quartz (opt. quartz/alumina)
- Diameter: 50–150 mm (customizable)
- Length: 600–2000 mm (based on application)
- Access: Easy insertion/removal with vacuum sealing
✅ Gas Delivery
- MFC Accuracy: ±1% of full scale
- Gas Lines: SS316L
- Inlet Ports: Up to 4–6 independent lines
- Exhaust: Vacuum compatible exhaust line
✅ Controls & Interface
- Controller: PLC + HMI (7–12 inch touchscreen)
- Recipe Storage: 100+ recipes
- Communication: USB / Ethernet
- Data Logging: Temperature, pressure, flow logs
✅ Safety
- Over-temperature shut-off
- Vacuum fail safe (auto close valves)
- Gas purging interlocks
