RF/DC Magnetron Sputtering System

• Single as well as multi target sputter source option
• Sputter configuration available from 1-6 Sputter sources in sputter up or sputter down
• Suitable for co-deposition as well as sequential deposition
• Customize combination available base on process requirement
• Compact foot print for better utilization of available space
• Manual, semi-automatic or fully automatic mode

System Features

• Material: SS304, SS304L, SS316
• Geometry: Cylindrical, Box type, D-shaped, Spherical
• High vacuum pumping system: Cryo pump, Turbo Molecular pump, Diffussion pump
• Base pressure: 10^-7 torr by using suitable capacity turbo molecular pump
• Electro-polished process chamber from inner and outer side for better vacuum performance
• Extra ports for future up-gradation as per user requirement