High-Purity Sputtering Targets You Can Trust

Power your thin-film processes with high-purity sputtering targets engineered for stable plasma, uniform films, and long target life. We supply 3N–5N purity targets to customers in semiconductor, display, solar, optical coating, and advanced R&D industries worldwide.

From standard metals to custom alloys and ceramics, our targets deliver consistent deposition performance—batch after batch.

Why Customers Choose Us

  • Ultra-high purity (up to 99.999%) for critical thin-film applications
  • High-density targets for reduced arcing and particle generation
  • Tight process control for repeatable film quality
  • Custom sizes & compositions to match your sputtering system
  • Cleanroom-grade packaging with full CoA and traceability

Materials We Supply

  • Metals: Pure elemental targets across a wide range of atomic numbers like Al, Cu, Ti, Cr, Ni, Mo, Ta, W
  • Alloys: Binary and multi-component alloys with controlled composition like Al-Si, Al-Cu, Ti-Al, Ni-Cr (custom compositions available)
  • Ceramics & Compunds: Oxides, nitrides, carbides, and functional ceramics like ITO, Al₂O₃, TiN, Si, SiO₂

Compatible with DC, RF, and pulsed-DC magnetron sputtering systems.

Typical Technical Specifications

Parameter Specification
Purity 99.9% – 99.999% (3N–5N)
Density ≥ 99.5% of theoretical
Electrical Resistivity Material-specific (e.g. Al ~2.7 µΩ·cm, Cu ~1.7 µΩ·cm)
Bonding Type Indium bonded / Elastomer bonded / Unbonded
Target Forms Circular, Rectangular, Custom
Backing Plates Cu / Al / SS (as required)

Specifications vary by material and target geometry.

Typical Technical Specifications

  • Semiconductor metallization & barrier layers
  • LCD / OLED display manufacturing
  • Thin-film photovoltaic modules
  • Optical & functional coatings
  • Research labs and pilot production lines