Cylindrical Magnetron Sputtering System

Advanced Process Technology Pvt. Ltd. has successfully developed and commercialized India’s first Cylindrical Magnetron Source for sputtering applications. This advanced sputtering solution enables high-quality thin film deposition on internal cylindrical surfaces and also supports large-area deposition up to 2 meters.

Overview

The Cylindrical Magnetron Sputtering System is engineered to deposit uniform and high-density thin films on internal surfaces of tubes, pipes, and hollow cylindrical components as well as large-area linear substrates up to 2000 mm length.

Key Highlights

• First indigenous Cylindrical Magnetron Sputtering System developed in India
• Enables coating of internal cylindrical geometries
• Supports large-area sputtering up to 2 meters
• Target utilization up to 85%
• Reduced material wastage and operating cost

Working Principle

The cylindrical magnetron geometry enables uniform plasma confinement around the full target circumference, leading to highly uniform target erosion. This results in a target utilization efficiency of up to 85%, significantly higher than conventional planar magnetrons, which typically achieve only 30–40%..

System Configuration

• Cylindrical Magnetron Cathode
• High-vacuum stainless steel chamber
• DC / Pulsed DC / RF power supply
• Mass Flow Controllers for process gases
• PLC/PC-based control system

Applications

• Internal coating of pipes and tubular components
• Wear-resistant and corrosion-resistant coatings
• Functional and barrier thin films

System Configuration

Cylindrical Magnetron Cathode

• Custom-designed cylindrical target geometry
• Optimized magnetic field for uniform erosion
• Suitable for metallic, alloy, and compound targets
• Excellent thermal management for high-power operation

Vacuum Chamber

• High-vacuum stainless steel chamber
• Configurable for cylindrical parts or large-area substrates
• Turbo-molecular pump with dry or rotary backing pump

Power Supply Options

• DC for conductive targets
• Pulsed DC for arc-sensitive processes
• RF for dielectric materials

Gas Handling System

• Mass Flow Controllers (MFCs) for Argon and reactive gases
• Support for reactive sputtering with O₂, N₂, etc.

Substrate Handling

• Fixed or rotating substrate configurations
• Custom fixtures for tubes, pipes, and hollow components
• Optional heating or biasing

Control & Automation

• PLC or PC-based control system
• Real-time monitoring of pressure, power, gas flow, and deposition parameters
• Recipe-based process control