E Beam Evaporation System
The Electron Beam (E‑Beam) Evaporation System from Advanced Process Technology Pvt. Ltd. is designed for high‑rate, high‑precision thin‑film deposition of refractory metals and dielectric materials. Utilizing a focused high‑energy electron beam, the system delivers excellent film density, superior adhesion, and outstanding thickness uniformity, making it ideal for both R&D and production environments.
E‑Beam evaporation is especially suited for materials with high melting points and enables precise control over deposition rate and film thickness for advanced multilayer structures.
Key Features
- Multi‑pocket electron beam gun (4 or 6 pocket configuration)
- High deposition rates suitable for refractory materials
- Real‑time deposition rate and thickness monitoring
- Large stainless‑steel vacuum chamber for batch substrates
- Substrate rotation for improved thickness uniformity
- Substrate heating up to 600 °C
- Optional load‑lock for reduced cycle time and contamination
- User‑friendly PLC/PC‑based system control (optional)
Applications
- Refractory metals: Ti, Cr, Ni
- Refractory and optical oxides: Al₂O₃ and related compounds
- High‑κ dielectric thin films
- Optical and multilayer coatings
- Microelectronics, optoelectronics, and advanced material research
- Substrate heating up to 600 °C
- Optional load‑lock for reduced cycle time and contamination
- User‑friendly PLC/PC‑based system control (optional)
Typical Specifications
| Parameter | Specification |
| Deposition Method | Electron Beam Evaporation |
| E Beam Gun | 4 / 6 Pocket |
| Beam Power | Up to 10 kW |
| Base Pressure | ≤ 1 × 10⁻⁷ Torr |
| Ultimate Vacuum | ~ 1 × 10⁻⁷ Torr |
| Thickness Monitoring | Dual Quartz Crystal Monitor |
| Substrate Size | Up to 8 inch wafer |
| Substrate Heating | Ambient to 600 °C |
| Substrate Rotation | Standard |
| Pumping System | Rotary + Turbo Molecular Pump / Cryo Pump (Optional) |
| Chamber Material | SS 304 / SS 316 |
| Applications | Refractory metals, optical and dielectric coatings |
Customization & Options
- Load‑lock chamber configuration
- Cryogenic pumping system
- Larger substrate sizes on request
- Advanced process automation and data logging
Advanced Process Technology Pvt. Ltd. offers complete in‑house design, manufacturing, installation, and after‑sales support for Electron Beam Evaporation Systems tailored to customer‑specific process requirements.
