RF/DC Magnetron Sputtering System
For R&D and Commercial Thin Film Applications
Advanced Process Technology Pvt. Ltd. manufactures high-performance RF / DC Magnetron Sputtering Systems designed for precise and repeatable thin film deposition. Our systems support deposition of metals, dielectrics, and compound materials, making them suitable for research laboratories, pilot lines, and commercial production.
Key Features
- Dual RF & DC sputtering capability
- Multi-target magnetron configuration (up to 6 cathodes)
- High-vacuum stainless steel chamber with turbo-molecular pump/ Cryo Pump/ Diffusion pump
- Substrate heating up to 400–800 °C (model dependent)
- Substrate rotation for improved uniformity
- Automatic process control with recipe storage
- MFC-based gas delivery
- Optional load-lock system
- Quartz crystal thickness monitoring
Applications
Semiconductors, optical coatings, MEMS, sensors, transparent conductive oxides (ITO, AZO), magnetic thin films, and multilayer coatings.
Typical Specifications
- Ultimate Base Pressure: ~ 1 × 10⁻⁶ Torr
- RF Power: Up to 600 W per source
- DC Power: Up to 3 kW with arc protection
- Target Sizes: Ø 2″, 3″, 4″, 6″
- Substrate Size: Up to 4″ / 6″ wafers
Technical Specifications
| Parameter | Specification |
| Deposition Technique | RF & DC Magnetron Sputtering |
| Target Size | 2″, 3″, 4″, 6″ |
| Number of Cathodes | 1 to 6 |
| RF Power Supply | 13.56 MHz, up to 600 W |
| DC Power Supply | Up to 3 kW with arc protection |
| Base Pressure | ≤ 5 × 10⁻⁶ Torr |
| Working Pressure | 1 × 10⁻³ to 1 × 10⁻² Torr |
| Chamber Material | SS 304 / SS 316 |
| Substrate Heating | Ambient to 800 °C |
| Substrate Rotation | 5 – 30 RPM |
| Process Gases | Ar, O₂, N₂ |
| Control System | PLC / SCADA / PC-based |
Magnetron Sputtering
