Magnetron Sputtering Cathodes
Planar | Rectangular | Cylindrical
Advanced Process Technology Pvt. Ltd. (APT) designs and manufactures a complete range of high-performance magnetron sputtering sources, including planar (circular), rectangular, and cylindrical magnetrons. Our magnetrons are engineered for high plasma density, uniform erosion, efficient cooling, and long operating life, making them suitable for both R&D and industrial coating applications.
All APT magnetrons feature indirect water cooling, high-strength NdFeB permanent magnets, and are compatible with RF, DC, and Pulsed DC power supplies. The designs allow quick and easy target replacement, minimizing downtime and improving productivity.
Importance of Magnetron Design & Uniformity
The performance of a sputtering system is highly dependent on the magnetron source design. Key factors such as magnetic field strength, erosion profile, cooling efficiency, and target utilization directly influence film thickness uniformity, repeatability, and process stability.
Well-designed magnetron sources provide:
- Uniform plasma distribution across the target surface
- Consistent erosion profiles for maximum target utilization
- Stable discharge for repeatable film properties
- Uniform film thickness across the substrate area
- Reduced particle generation and arcing
For large-area and industrial applications, uniformity is critical to ensure consistent optical, electrical, and mechanical properties across the coated surface.
Film Uniformity & Process Stability
APT magnetron sources are engineered to deliver excellent film thickness and property uniformity, whether used in laboratory-scale systems or large-area industrial platforms. Uniformity is achieved through:
- Balanced magnetic field design
- Stable plasma over the full target length or area
- Optimized target-to-substrate geometry
- Compatibility with substrate rotation and motion systems
This results in repeatable coating performance, minimal edge effects, and improved process control across different materials and operating conditions.
Key Common Features
- Indirect water-cooled design for enhanced thermal stability
- High-strength NdFeB magnet assemblies for stable plasma confinement
- Compatible with RF, DC, and Pulsed DC power supplies
- Uniform erosion profile for maximum target utilization
- Easy and fast target replacement
- Robust construction for long process life
- Suitable for metallic, ceramic, and compound targets
Planar (Circular) Magnetron Sputtering Sources
Description
APT planar (circular) magnetrons are compact, high-performance sputtering sources designed for laboratory-scale and pilot production systems. These magnetrons provide excellent plasma uniformity and are ideal for research, thin-film development, and small-area coating applications.
Typical Specifications – Planar Magnetron
| Parameter | Specification |
| Magnetron Type | Planar (Circular) |
| Target Diameter | 1″ to 6″ |
| Target Thickness | As per standard target specifications |
| Cooling Method | Indirect water cooling |
| Magnet Type | High-strength NdFeB |
| Power Compatibility | RF / DC / Pulsed DC |
| Target Material | Metals, alloys, ceramics |
| Erosion Uniformity | Optimized for high target utilization |
| Mounting | Standard flange or custom |
| Applications | R&D, thin-film development, small-area coatings |
Rectangular Magnetron Sputtering Sources
Description
APT rectangular magnetron sputtering sources are designed for uniform large-area deposition and are widely used in optical coatings, display technologies, architectural glass, and functional thin films. These magnetrons can be supplied in standard industry sizes or fully customized to meet specific customer requirements.
Typical Specifications – Rectangular Magnetron
| Parameter | Specification |
| Magnetron Type | Rectangular |
| Target Size | Standard market sizes or custom |
| Active Target Length | As per application requirement |
| Cooling Method | Indirect water cooling |
| Magnet Type | High-strength NdFeB |
| Power Compatibility | RF / DC / Pulsed DC |
| Target Replacement | Easy and quick |
| Plasma Uniformity | Optimized for large-area coating |
| Mounting | Standard or customized |
| Applications | Optical coatings, display films, functional layers |
Cylindrical Magnetron Sputtering Sources
Description
APT cylindrical magnetron sputtering sources are engineered for high-throughput and large-area coating applications, including roll-to-roll and inline coating systems. With lengths up to 2 meters, these magnetrons provide excellent uniformity, high deposition rates, and efficient cooling for continuous operation.
Typical Specifications – Cylindrical Magnetron
| Parameter | Specification |
| Magnetron Type | Cylindrical |
| Maximum Length | Up to 2 meters |
| Target Configuration | Rotating or stationary (as required) |
| Cooling Method | Indirect water cooling |
| Magnet Type | High-strength NdFeB |
| Power Compatibility | RF / DC / Pulsed DC |
| Target Utilization | High due to uniform erosion |
| Operation Mode | Continuous / high-duty cycle |
| Applications | Roll-to-roll coating, large-area PVD systems |
Customization & Integration
- Custom target sizes and geometries
- Compatibility with APT PVD systems and third-party chambers
- Optimized magnet designs for specific materials
- Integration with manual or automated coating platforms
Applications
APT magnetron sources are used across a wide range of applications, including:
- Optical and decorative coatings
- Functional and protective thin films
- Semiconductor and electronics research
- Roll-to-roll and large-area coating systems
- Advanced materials R&D