Thermal Evaporation System
High-Purity Thin Film Deposition for Metals & Organic Layers
The Thermal Evaporation System from Advanced Process Technology Pvt. Ltd. is designed for high-purity deposition of metallic and organic thin films with excellent thickness control and uniformity. The system uses resistive heating of evaporation sources under high vacuum, making it ideal for R&D laboratories as well as pilot-scale production.
Our systems support metal evaporation, organic layer deposition, and multilayer structures, making them suitable for semiconductor, optoelectronic, and optical coating applications.
Key Features
- Resistive thermal evaporation for metals and organic materials
- Multiple evaporation sources using Ta, W, or Mo boats/crucibles
- Quartz Crystal Microbalance (QCM) for real-time thickness and rate monitoring
- Precision substrate heating up to ~500°C – 800°C
- High-vacuum pumping system with rotary + turbo molecular pump/ diffusion pump
- Manual or pneumatic shutter control for precise layer definition
- Compact stainless-steel chamber with excellent vacuum integrity
- Modular design allowing future upgrades and customization
Organic Layer Deposition Capability
The system can be configured specifically for organic thin film deposition, suitable for applications such as OLEDs and organic electronics.
Organic Deposition Options Include:
- Low-temperature evaporation for organic semiconductors
- Dedicated organic evaporation boats/crucibles
- Low deposition rate control for sensitive organic materials
- Optional cooled substrate holder for organic layers
- Multi-source configuration for organic/metal multilayers
Typical Applications:
- Metal thin films: Au, Ag, Al, Cu
- Organic semiconductor layers
- Proof-of-concept device structures
- Optical coatings and reflective layers
- Contact electrodes and interconnects
- Passivation and buffer layers
- OLED and organic electronics research
Typical Specifications:
| Parameter | Specification |
| Deposition Method | Resistive Thermal Evaporation |
| Evaporation Sources | Tungsten, Molybdenum, Tantalum boats |
| Number of Sources | 1 to 4 |
| Base Pressure | ≤ 1 × 10⁻⁶ Torr |
| Deposition Rate | 0.1 – 50 Å/s |
| Thickness Control | ±1% |
| Substrate Size | Up to 6″ wafer |
| Substrate Heating | Ambient to 500 °C |
| Power Supply | High-current, low-voltage |
| Thickness Monitor | Quartz Crystal Microbalance (QCM) |
| Shutter | Manual / Pneumatic |
| Chamber Material | SS 304 |
| Pumping System | Rotary Pump + Turbo Molecular Pump |
| Supported Materials | Au, Ag, Al, Cu, Organic films |
Customization & Options
- Load-lock chamber (optional)
- Automated recipe-based control
- Multiple QCM sensors
- Larger substrate holders
- Organic-dedicated evaporation module
- Integration with glove box for air-sensitive materials