Vacuum Chambers
Advanced Process Technology Pvt. Ltd. (APT) designs and manufactures customized high vacuum and ultra-high vacuum (UHV) compatible vacuum chambers engineered to meet exact customer and process requirements. Our chambers are built for reliable operation, ultra-low leak rates, and long-term vacuum stability, making them suitable for advanced thin film deposition, semiconductor processing, surface science, and research applications.
Precision Engineering & Custom Design
Every APT vacuum chamber is custom-designed based on application-specific requirements such as chamber geometry, pumping configuration, process sources, substrate handling, and integration with auxiliary equipment. Our in-house engineering team uses advanced 3D CAD modeling and structural analysis to ensure optimal mechanical strength, vacuum performance, and serviceability.
Chambers can be configured in rectangular, cylindrical, spherical, or hybrid geometries, with single or multiple access doors, load-lock integration, and modular expansion options.
Ultra-Low Leak Performance
All vacuum chambers manufactured by APT are helium leak tested and certified to leak rates as low as:
≤ 1 × 10⁻¹² Torr·lit/sec
This ensures clean, stable vacuum environments required for UHV systems, thin film deposition processes, and contamination-sensitive applications.
Materials & Surface Finish
APT offers a wide range of chamber materials to match specific process, temperature, and chemical compatibility requirements:
- Stainless Steel: SS304, SS304L, SS316, SS316L
- Aluminum Chambers for lightweight and rapid pump-down applications
Internal surfaces are finished using electro-polishing, mechanical polishing, or specialized surface treatments to minimize outgassing and improve base pressure performance.
UHV-Compatible Construction
Our chambers are designed and manufactured following UHV best practices, including:
- All-metal sealing using CF (ConFlat®) flanges
- Provision for ISO and KF flanges where required
- Vacuum-compatible welding techniques with full penetration welds
- Optimized port placement for uniform pumping and diagnostics
- Compatibility with bake-out procedures for achieving ultra-low base pressures
This results in repeatable coating performance, minimal edge effects, and improved process control across different materials and operating conditions.
Integration & Process Compatibility
APT vacuum chambers are designed for seamless integration with a wide range of processes and subsystems, including:
- RF / DC sputtering sources
- PECVD and CVD systems
- Thermal and electron beam evaporation sources
- Ion beam sources and plasma systems
- Glove box interfaces and load-lock systems
- Automated substrate handling and process control
Applications
- Thin film deposition systems
- Semiconductor and microelectronics processing
- Surface science and materials research
- Optical and functional coatings
- Energy storage and advanced materials development
Quality & Manufacturing Excellence
All chambers are manufactured at APT’s in-house facility using precision machining, controlled welding procedures, and rigorous inspection protocols. Each chamber undergoes dimensional verification, vacuum performance testing, and leak certification prior to delivery.
Key Features at a Glance
- Customized high vacuum and UHV vacuum chambers
- Leak tested up to 1 × 10⁻¹² Torr·lit/sec
- Stainless steel and aluminum construction
- UHV-compatible welding and sealing
- Designed for advanced thin film and semiconductor processes
- Seamless integration with deposition and process equipment
TECHNICAL DATA SHEET
Vacuum Performance
| Parameter | Specification |
| Vacuum Range | High Vacuum to Ultra-High Vacuum |
| Typical Base Pressure | ≤ 1 × 10⁻⁹ Torr (system dependent) |
| Certified Leak Rate | ≤ 1 × 10⁻¹² Torr·lit/sec |
| Leak Test Method | Helium Mass Spectrometer |
| Bake-out Compatibility | Yes |
Construction & Materials
| Parameter | Specification |
| Chamber Geometry | Rectangular / Cylindrical / Customized |
| Materials | SS304, SS304L, SS316, SS316L, Aluminum |
| Internal Finish | Mechanical Polishing / Electropolishing |
| Welding | UHV-compatible full penetration welds |
| Design Validation | Structural & Thermal FEA |
Flanges & Interfaces
| Parameter | Specification |
| Flange Standards | CF (ConFlat®), ISO, KF |
| Sealing Type | All-metal (Copper gasket) / Elastomer (Viton®) |
| Viewports (Optional) | Fused Silica / Borosilicate / Sapphire |
| Feedthroughs (Optional) | Electrical, RF, Thermocouple, Fluid |
